VPX3-217 3U VPX PCIe Gen 2 Switch and Ethernet Switch XMC Carrier Card
- REQUEST A QUOTE
- Five x4 (fat-pipe) Gen 2 PCIe ports to backplane
- P1A, P1B, P1C, P1D, P2A
- PCI Express Gen 2 fat pipe to XMC site Pn5 connector
- Optional XMC-651 Ethernet switch support
- High performance XMC site supporting x4 Gen 2 PCIe to XMC as per VITA 42.4
- XMC Pn6 I/O to backplane – tailored for XMC-651 Ethernet switch
- Implements data and control planes with XMC-651
- 3U HPEC applications
- 3U SIGINT/COMINT
The VPX3-215 ExpressReach 3U VPX carrier card is a member of the 3U VPX line of embedded ruggedized products. Designed to integrate with Curtiss-Wright PCI mezzanine cards (PMCs), this fully...
XMC and IPM carrier card provides great flexibility to system integrators needing to expand their VPX-based systems' I/O complement via standard PMC modules and/or XMC modules. A direct PCIe...
Small form factor (3U) products allow system developers to take advantage of commercial off-the-shelf (COTS) solutions for space and weight constrained environments that cannot accommodate the 6U form factor standard. The challenge of high density computing is to pack the greatest functionality into the smallest standard form factor, with the lowest power possible, while maintaining flexibility. While small in size, 3U products offer impressive processing power and I/O capability to handle large applications.
The VPX3-217 3U VPX ExpressReach carrier card is a member of the 3U VPX line of embedded ruggedized products. Its primary function is to provide a switched Gen 2 PCIe fabric for small and mediumsized VPX PCIe-centric systems supporting up to five host/payload modules. In addition, the VPX3-217 can optionally host the Curtiss-Wright XMC-651 Ethernet switch on its integral XMC site. The XMC-651 provides four ports of Gigabit Ethernet (GbE) supporting tri-speed 10/100/1000Base-T (twisted pair) and four ports of 1000Base-X (SerDes) GbE. In this configuration, PCIe forms the data plane while GbE implements the internal and external control plane in high density, high performance signal processing applications.
Alternatively, the VPX3-217 can host other XMC modules providing their I/O matches that implemented on the VPX3-217 (contact us for more information).
The VPX3-217 is a rugged conduction-cooled module with primary and secondary thermal interfaces and a mid-plane for mezzanine cooling.
Contact our sales team today to learn more about our products and services.
Our support team can help answer your questions - contact us today.