Leveraging Curtiss-Wright's extensive 3U OpenVPX ecosystem, these modules form the centerpiece of new small form factor high performance embedded computing system architectures. These very high performance 3U Intel Xeon D-based digital signal processing products provide optimized performance within strict SWaP constraints and are backed by world-class customer support and lifecycle management to support the programmatic needs of defense customers. Available in 3U VPX, the Curtiss-Wright COTS Intel Xeon D digital signal processor cards include air-cooled and conduction-cooled ruggedization levels.
These open architecture COTS modules feature high-speed DDR4 memory as well as cutting edge bandwidth along the OpenVPX data, expansion, and control planes, creating a module architecture that can fully utilize the multi-core performance of Intel Xeon D processors. The new board family makes it easy for customers to extend their applications across different platforms and payloads, enabling system designers to fully leverage their investment in software development.
To maximize system configuration flexibility, these size, weight, power and cost (SWaP-C) optimized modules also feature XMC card expansion and the choice of 1 Gigabit or 10 Gigabit Ethernet (GbE) interfaces along the control plane.
Paul Davis, Director, Product Management - Data Solutions wrote about Pushing Airborne ISR Data Recorders to New Performance Heights in Military Embedded Systems Magazine.
|Product Sheet||Product Name||IMAGE||Product Type||Form Factor||Standard||Processor / FPGA||# of CPUs||Mezzanine||Backplane Fabric|
|CHAMP-XD1S Digital Signal Processor with TrustedCOTS Security||DSP||3U||OpenVPX, VPX, VPX-REDI||Xilinx Zynq UltraScale+ MPSoC, Intel Xeon D||1||XMC||SATA Gen3, PCIe Gen 3, USB, 1 GbE, 10 GbE|
|CHAMP-XD1 Digital Signal Processor||DSP||3U||OpenVPX, VPX, VPX-REDI||Intel Xeon D||1||XMC||PCIe Gen 3, USB, 1 GbE, 10 GbE|