Curtiss-Wright Defense Solutions

CHAMP-XD2M Digital Signal Processor

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Key Features

Xeon D 16-core processor (870 GFLOPS @ 1.7 GHz)
Alternative Xeon D SKUs available
128 GB DDR4 @ 2133 MT/s (34 GBps over 2 ECC channels)
Four ports of 40G/10G Ethernet or DDR/QDR/FDR10 InfiniBand on OpenVPX data plane
Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane
XMC PCIe up to Gen3, designed for up to 25W thermal dissipation
Dual x16 PCIe Gen3 on OpenVPX expansion plane with switch
PCH integrated in Xeon D SoC
Core Function FPGA (Xilinx UltraScale) and IPMI (Microchip SmartFusion)
Air and conduction-cooled
TrustedCOTS

Applications

Sensor fusion
Mobile platform server
Synthetic Aperture Radar (SAR)
Signal Intelligence (SIGINT)
Electro-Optical/Infrared (EO/IR)
Mission computing
Industrial server applications

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6U Intel Xeon D Digital Signal Processor

CHAMP-XD2 Digital Signal Processor

Facing increasing SWaP-C demands and harsh environments, boards now need to be smaller and more powerful than ever, while still working with tight budgets. Standard cooling methods offer a...

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6U OpenVPX High Memory Capacity Intel Xeon D Processor Card

Imaging sensors, RADAR, and SIGINT provide an overwhelming amount of data that needs to be stored before it can even be processed, but current solutions offer far from enough memory to store it. By providing more memory capacity on a single board, systems can remain SWaP-C optimized and data can be connected and processed with ease.

At Curtiss-Wright, we removed one Xeon D from our dual CHAMP-XD2 board to bring you the maximum amount of memory possible on a board and increase memory capacity by 400%, removing the obstacle of data storage and allowing you to get the data you need onboard and processed faster than ever.

The 6U OpenVPX CHAMP-XD2M rugged Intel Xeon D module is designed for use in high memory capacity, compute-intensive Industrial, Aerospace and Defense applications, enabling developers of High Performance Embedded Computing (HPEC) systems to take full advantage of the unmatched performance of today’s leading-edge Xeon processor D architecture.

Leveraging Curtiss-Wright’s extensive 6U OpenVPX ecosystem, the CHAMP-XD2M forms the centerpiece of high memory capacity, high core count HPEC system architectures. Other Curtiss-Wright 6U OpenVPX modules available for HPEC configurations include the dual Xeon D based CHAMP-XD2, VPX6-1958/VPX6-1959 Single Board Computers, VPX6-6802 Ethernet/InfiniBand Switch, CHAMP-GP GPGPU Processors, and CHAMP-FX4 FPGA-based ADC/DAC modules.

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